FR4 Glass Epoxy Prototype Circuit Board 1-18 Layers PCB Assembly Services

Place of Origin:

China (Mainland)

Brand Name:

OEM

Model Number:

E020

Base Material:

Copper Thickness:

1/3 oz- 6 oz

Board Thickness:

0.2 mm - 6.0 mm

Min. Hole Size:

0.2 mm

Min. Line Width:

3 mil

Min. Line Spacing:

3 mil

Surface Finishing:

Layer:

2 - 12 layers

Solder Mask:

All kinds of Color

Impedance Control:

+/- 10%

Product:

FR4 glass epoxy PCB Circuit Board

Layer

1-18 layers

Board thickness

0.2-6.0 mm

Laminates type

FR-4, CEM-1, CEM-3, BT Resin, Teflon, PTFE, Rogers, Aluminium, Tg130(150,170,180, 210), Berquist, Thermagon, Alon.Polyclad

Base copper thickness

Min: 12um (1/3oz)

Max: 140um (4oz) for inner layer;

210um (6oz) for outer layer

Min finished hole size

By mechanical drilling: 0.2mm (0.008")

Aspect ratio

8:1

Max panel size

Mass production: 540mm × 740m (21.25" × 29.13")

Sample: 540mm × 1100mm (21.25" × 43.3")

Min line width/space

3 mil/3 mil

Via hole type

Blind, Burried

Surface finish

HASL/ Lead Free HASL,

Immersion Gold / Silver / Tin,

Flash Gold, Hard Gold plating, Selective thick Gold Plating,

Gold Finger (Gold thickness up to 3um),

Plating Silver,

Carbon ink, Peelable mark, OSP

Solder mask

All kinds of colour,

LPI, Dry Film,

Min S/M pitch (LPI): 0.1mm

Impedance Control

Single trace or differential controlled

50, 60, 70, 100, 110, 120, 130 ±10%

Min bonding pitch

0.181mm (center to center)

Min SMT pitch

0.400mm (center to center)

Min annular ring

0.025mm

Outline finish type

CNC Routing; V-Scoring/Cut; Punch

Tolerances

Min Hole registration tolerance (NPTH) ± 0.025mm

Min Hole registration tolerance (PTH) ± 0.075mm

Min Pattern registration tolerance ± 0.05mm

Min S/M registration tolerance (LPI) ± 0.075mm

Scoring Lines ± 0.15mm

Board thickness (0.1 -1.0mm ) ±15%

Board thickness (1.0 -6.35mm ) ±10%

Board Size Routed ± 0.13mm

Board Size Scored ± 0.2mm

Electrical Testing

Voltage: 10V - 250V

Continuity: 10 - 1000 Ohms